Patent Assignment
Reel/Frame 061070/0581
Assignment of Assignor's Interest
Recorded: 2022-08-03
Pages: 14
Assignors
HOU, MENGJUN
Executed: 2021-12-28
MA, XIANGGUO
Executed: 2021-12-28
GENG, KAI
Executed: 2021-12-28
WU, QIONG
Executed: 2021-12-28
WANG, YOUXUE
Executed: 2021-12-28
LIU, ZONGMIN
Executed: 2021-12-28
Assignees
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
ROOM 407, BUILDING 1,NO.9 DIZE ROAD,BDA, BEIJING, 100176, CHINA
BOE TECHNOLOGY GROUP CO., LTD.
NO.10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Chip Loading Structure, Analysis Device, and Analysis System