Patent Assignment
Reel/Frame 061075/0651
Assignment of Assignor's Interest
Recorded: 2022-09-13
Pages: 10
Assignors
CHOI, JAEMYUNG
Executed: 2022-09-04
LEE, JANGGEUN
Executed: 2022-08-31
HONG, WONHYUK
Executed: 2022-09-06
SEO, KANG-ILL
Executed: 2022-09-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including Metal Structures Having a Curved Interface and Methods of Forming the Same
Application:
17/929,833 →
Publication:
US 2023/0369111