IP Library Assignment 061075/0651
Patent Assignment
Reel/Frame 061075/0651

Assignment of Assignor's Interest

Recorded: 2022-09-13 Pages: 10
Assignors
CHOI, JAEMYUNG
Executed: 2022-09-04
LEE, JANGGEUN
Executed: 2022-08-31
HONG, WONHYUK
Executed: 2022-09-06
SEO, KANG-ILL
Executed: 2022-09-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Integrated Circuit Devices Including Metal Structures Having a Curved Interface and Methods of Forming the Same
Application: 17/929,833 →
Publication: US 2023/0369111