Patent Assignment
Reel/Frame 061078/0656
Assignment of Assignor's Interest
Recorded: 2022-09-13
Pages: 3
Assignors
JI, YUN JE
Executed: 2022-08-17
KIM, YONG HOON
Executed: 2022-08-17
LEE, SEUNG EUN
Executed: 2022-08-17
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Embedded Substrate