Patent Assignment
Reel/Frame 061090/0604
Assignment of Assignor's Interest
Recorded: 2022-09-14
Pages: 6
Assignors
KIM, HYOEUN
Executed: 2022-04-18
KIM, JUHYEON
Executed: 2022-04-19
LEE, WONIL
Executed: 2022-04-18
JEE, YOUNGKUN
Executed: 2022-04-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package Including Bonding Layers Having Alignment Marks