Patent Assignment
Reel/Frame 061092/0124
Assignment of Assignor's Interest
Recorded: 2022-09-14
Pages: 5
Assignors
LIN, HSIN-JOU
Executed: 2022-08-30
WANG, LUNG-YUAN
Executed: 2022-08-30
KAO, FENG
Executed: 2022-08-30
CHEN, CHIU-LING
Executed: 2022-08-30
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO.123, SEC. 3, DAFENG RD., TANZI DIST., TAICHUNG CITY, 427, TAIWAN
Covered Property
(1)
Electronic Package and Manufacturing Method Thereof
Application:
17/944,464 →
Publication:
US 2023/0178451