Patent Assignment
Reel/Frame 061108/0852
Assignment of Assignor's Interest
Recorded: 2022-09-15
Pages: 2
Assignors
LYE, MENG KONG
Executed: 2022-09-08
WANG, ZHIJIE
Executed: 2022-09-08
GE, YOU
Executed: 2022-09-08
LI, ZHIMING
Executed: 2022-09-08
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST, AUSTIN, TEXAS, 78735
Covered Property
(1)
Semiconductor Device Quad-Flat-No-Leads Package with Trenches for Improved Soldering and Method of Making Thereof
Application:
17/932,481 →
Publication:
US 2023/0115182