Patent Assignment
Reel/Frame 061116/0660
Assignment of Assignor's Interest
Recorded: 2022-09-16
Pages: 5
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OTA-KU, TOKYO, 144-8510, JAPAN
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method