Patent Assignment
Reel/Frame 061128/0261
Assignment of Assignor's Interest
Recorded: 2022-09-18
Pages: 6
Assignors
KIM, TONGSUNG
Executed: 2022-07-04
JO, YOUNGMIN
Executed: 2022-07-04
YOON, CHIWEON
Executed: 2022-07-04
CHUN, BYUNGKWAN
Executed: 2022-07-12
JEONG, BYUNGHOON
Executed: 2022-07-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Memory Package, Semiconductor Device, and Storage Device