Patent Assignment
Reel/Frame 061136/0172
Assignment of Assignor's Interest
Recorded: 2022-09-19
Pages: 6
Assignors
LEE, JONG JIN
Executed: 2022-08-30
YOO, SEUNG YONG
Executed: 2022-08-30
JUNG, EUN-JI
Executed: 2022-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating Thereof