Patent Assignment
Reel/Frame 061174/0325
Assignment of Assignor's Interest
Recorded: 2022-09-22
Pages: 4
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Wire Bonding Device, Wire Cutting Method and Non-Transitory Computer-Readable Recording Medium Recording Program
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.