Patent Assignment
Reel/Frame 061178/0160
Assignment of Assignor's Interest
Recorded: 2022-09-22
Pages: 3
Assignors
CHEN, HSIAO-YUN
Executed: 2022-08-11
HUANG, YAO-TSUNG
Executed: 2022-08-11
CHANG, CHENG-JYI
Executed: 2022-08-11
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure
Application:
17/934,233 →
Publication:
US 2023/0125239