Patent Assignment
Reel/Frame 061189/0486
Assignment of Assignor's Interest
Recorded: 2022-09-23
Pages: 5
Assignors
LIN, TSENG HSING
Executed: 2022-08-24
LEE, CHIEN-HSUN
Executed: 2022-08-16
WANG, TSUNG-DING
Executed: 2022-08-16
CHENG, JUNG-WEI
Executed: 2022-08-16
HOU, HAO-CHENG
Executed: 2022-08-16
LIN, SHENG-CHI
Executed: 2022-08-16
WANG, JENG-AN
Executed: 2022-08-16
WU, YAO-CHENG
Executed: 2022-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method of Forming the Same