Patent Assignment
Reel/Frame 061219/0274
Assignment of Assignor's Interest
Recorded: 2022-09-26
Pages: 7
Assignors
SHIN, DONG SUK
Executed: 2022-09-13
YU, HYUN-KWAN
Executed: 2022-09-13
KIM, SEOK HOON
Executed: 2022-09-13
PARK, PAN KWI
Executed: 2022-09-13
KIM, YONG SEUNG
Executed: 2022-09-19
KIM, JUNG TAEK
Executed: 2022-09-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method for Fabricating Thereof
Application:
17/935,528 →
Publication:
US 2023/0253449