Patent Assignment
Reel/Frame 061219/0897
Assignment of Assignor's Interest
Recorded: 2022-09-26
Pages: 6
Assignors
CHO, YOUNGSANG
Executed: 2022-08-08
LEE, HEESEOK
Executed: 2022-08-10
IM, YUNHYEOK
Executed: 2022-08-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Having Improved Heat Dissipation Characteristics