Patent Assignment
Reel/Frame 061246/0049
Assignment of Assignor's Interest
Recorded: 2022-09-28
Pages: 8
Assignee
KYOCERA CORPORATION
6 TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SHI, KYOTO, 612-8501, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Element, Semiconductor Element Body, and Semiconductor Element Substrate