Patent Assignment
Reel/Frame 061248/0923
Assignment of Assignor's Interest
Recorded: 2022-09-28
Pages: 5
Assignors
LU, WEN-LING
Executed: 2022-07-04
CHIU, YU-CHIEN
Executed: 2022-07-04
CHANG, CHIH-YU
Executed: 2022-07-04
LI, HUNG-WEI
Executed: 2022-09-15
CHENG, YA-YUN
Executed: 2022-07-04
WU, ZHIQIANG
Executed: 2022-07-04
LIN, YU-MING
Executed: 2022-07-04
MANFRINI, MAURICIO
Executed: 2022-07-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6 HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same
Application:
17/840,824 →
Publication:
US 2023/0413571