Patent Assignment
Reel/Frame 061253/0387
Assignment of Assignor's Interest
Recorded: 2022-09-29
Pages: 10
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 1010045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Processing Substrate, Method of Manufacturing Semiconductor Device, and Recording Medium