Patent Assignment
Reel/Frame 061264/0787
Assignment of Assignor's Interest
Recorded: 2022-09-30
Pages: 6
Assignors
LEE, KYUNGHWAN
Executed: 2022-04-20
KIM, YONGSEOK
Executed: 2022-04-21
KIM, HYUNCHEOL
Executed: 2022-04-20
PARK, JONGMAN
Executed: 2022-04-26
WOO, DONGSOO
Executed: 2022-04-21
LEE, MINJUN
Executed: 2022-04-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices with Improved Performance and Reliability and Manufacturing Methods for the Same