Patent Assignment
Reel/Frame 061269/0558
Assignment of Assignor's Interest
Recorded: 2022-09-30
Pages: 2
Assignors
CHEN, XIANMING
Executed: 2022-09-13
FENG, JINDONG
Executed: 2022-09-09
HUANG, BENXIA
Executed: 2022-09-09
HONG, YEJIE
Executed: 2022-09-09
Assignee
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD
FPC FACTORY, 3209 NORTH ZHUFENG AVENUE, DOUMEN, ZHUHAI,, GUANGDONG, 519175, CHINA
Covered Property
(1)
Two-Sided Interconnected Embedded Chip Packaging Structure and Manufacturing Method Therefor
Application:
17/957,138 →
Publication:
US 2023/0154857