Patent Assignment
Reel/Frame 061270/0228
Assignment of Assignor's Interest
Recorded: 2022-08-19
Pages: 8
Assignors
SONG, STANLEY SEUNGCHUL
Executed: 2022-06-03
KIM, JONGHAE
Executed: 2022-04-10
LAN, JE-HSIUNG
Executed: 2022-04-25
CHIDAMBARAM, PERIANNAN
Executed: 2022-08-16
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Three-Dimensional (3D) Integrated Circuit (Ic) (3DIC) Package Employing a Redistribution Layer (Rdl) Interposer Facilitating Semiconductor Die Stacking, and Related Fabrication Methods
Application:
17/657,760 →
Publication:
US 2023/0317677