Patent Assignment
Reel/Frame 061273/0941
Assignment of Assignor's Interest
Recorded: 2022-09-30
Pages: 10
Assignors
LEE, JANGEUN
Executed: 2022-08-21
NOH, HYOJUNG
Executed: 2022-08-30
SONG, MINWOO
Executed: 2022-08-25
HA, YONGHO
Executed: 2022-08-25
HWANG, JEONGWON
Executed: 2022-08-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Device
Application:
17/950,512 →
Publication:
US 2023/0178439