Patent Assignment
Reel/Frame 061288/0529
Assignment of Assignor's Interest
Recorded: 2022-10-03
Pages: 2
Assignors
SHAO, PO-CHUN
Executed: 2022-08-04
CHEN, SHIH-HSIEN
Executed: 2022-08-04
YU, PING-LUNG
Executed: 2022-08-04
Assignee
WINBOND ELECTRONICS CORP.
NO. 8, KEYA 1ST RD., DAYA DIST., CENTRAL TAIWAN SCIENCE PARK,, TAICHUNG CITY, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Structure