Patent Assignment
Reel/Frame 061304/0508
Assignment of Assignor's Interest
Recorded: 2022-10-04
Pages: 3
Assignors
PARK, JEONG BONG
Executed: 2022-09-29
LEE, HAN BOK
Executed: 2022-09-29
HAN, DA JEONG
Executed: 2022-09-29
CHUNG, HYE SOO
Executed: 2022-09-29
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component