IP Library Assignment 061312/0139
Patent Assignment
Reel/Frame 061312/0139

Change of Name

Recorded: 2022-08-24 Pages: 32
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
1-9-2 MARUNOUCHI, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
Application: 16/651,015 →
Publication: US 2020/0270447
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 9, 2020
From: MARUYAMA, NAOKI; YOSHIDA, YUKA; HIGASHIUCHI, TOMOKO; FUKUDA, KAZUMASA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052873/0962 →
Change of Name Feb 9, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062636/0323 →
Corrective Assignment to Correct the the Address of the Assignee Previously Recorded at Reel: 06236 Frame: 0323. Assignor(S) Hereby Confirms the Assignment. Mar 16, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 063193/0416 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →