Patent Assignment
Reel/Frame 061312/0647
Assignment of Assignor's Interest
Recorded: 2022-10-05
Pages: 4
Assignor
LEE, HANG LIM
Executed: 2022-09-26
Assignee
SEMES CO., LTD.
77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU, CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Bonding a Semiconductor Die to a Wafer