Patent Assignment
Reel/Frame 061318/0583
Assignment of Assignor's Interest
Recorded: 2022-10-05
Pages: 3
Assignor
MANIWA, SUSUMU
Executed: 2022-07-29
Assignee
TOPPAN INC.
TOPPAN KOISHIGAWA HQ BUILDING, 1-3-3 SUIDO, BUNKYO-KU, TOKYO, 112-8531, JAPAN
Covered Property
(1)
Glass Core Wiring Substrate Incorporating High-Frequency Filter, High-Frequency Module Using the Same, and Method of Manufacturing Glass Core Wiring Substrate Incorporating High-Frequency Filter