Patent Assignment
Reel/Frame 061337/0873
Assignment of Assignor's Interest
Recorded: 2022-10-06
Pages: 6
Assignors
PARK, JUNWOO
Executed: 2022-04-15
KIM, SANGSOO
Executed: 2022-04-15
KIM, SEUNGHWAN
Executed: 2022-04-15
KIM, JUNGJOO
Executed: 2022-04-25
LEE, YONGKWAN
Executed: 2022-04-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Package Substrate and Semiconductor Package Including the Same