Patent Assignment
Reel/Frame 061346/0064
Assignment of Assignor's Interest
Recorded: 2022-10-07
Pages: 14
Assignors
JUNG, MYUNGHOON
Executed: 2022-10-04
HONG, WONHYUK
Executed: 2022-09-29
HWANG, INCHAN
Executed: 2022-09-26
JO, GUNHO
Executed: 2022-10-06
SEO, KANG-ILL
Executed: 2022-09-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including Backside Power Rail and Methods of Forming the Same