Patent Assignment
Reel/Frame 061349/0278
Assignment of Assignor's Interest
Recorded: 2022-10-07
Pages: 6
Assignors
SAITOH, TAKAYUKI
Executed: 2022-09-22
MORIWAKI, TAKAYUKI
Executed: 2022-09-22
SHIMATSU, TAKEHITO
Executed: 2022-09-28
UOMOTO, MIYUKI
Executed: 2022-09-28
Assignees
CANON ANELVA CORPORATION
2-5-1, KURIGI, ASAO-KU, KAWASAKI-SHI, KANAGAWA, 2158550, JAPAN
TOHOKU UNIVERSITY
2-1-1, KATAHIRA, AOBA-KU, SENDAI-SHI, MIYAGI, 9808577, JAPAN
Covered Property
(1)
Chemical Bonding Method, Package-Type Electronic Component, and Hybrid Bonding Method for Electronic Device