Patent Assignment
Reel/Frame 061370/0477
Assignment of Assignor's Interest
Recorded: 2022-09-01
Pages: 14
Assignors
PAEK, JONG SIK
Executed: 2014-07-24
KIM, JIN YOUNG
Executed: 2014-07-24
KIM, JIN HAN
Executed: 2014-07-30
CHA, SE WOONG
Executed: 2014-07-24
BAE, JAE HUN
Executed: 2014-07-30
KIM, DONG JIN
Executed: 2014-07-28
PARK, DO HYUN
Executed: 2014-07-24
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property
(1)
Semiconductor Device with Redistribution Layers on Partial Encapsulation and Non-Photosensitive Passivation Layers
Application:
17/891,310 →
Publication:
US 2023/0057803
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 1, 2022
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
Reel/Frame 060964/0483 →
Corrective Assignment to Correct the the 7TH Inventors's Name Previously Recorded at Reel: 061370 Frame: 0477. Assignor(S) Hereby Confirms the Assignment.
Oct 19, 2022
From: PAEK, JONG SIK; KIM, JIN YOUNG; KIM, JIN HAN; CHA, SE WOONG
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 062555/0254 →
Assignment of Assignor's Interest
Apr 11, 2023
From: KIM, YOONJOO
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063288/0670 →
Assignment of Assignor's Interest
Apr 12, 2023
From: LEE, SEUNGJAE
To: AMKOR TECHNOLOGY, INC.
Reel/Frame 063299/0856 →