SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS
A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.
1 . A method for manufacturing a semiconductor device, the method comprising:
forming a pattern in a non-photosensitive protection layer;
providing a semiconductor die with a contact pad on a first surface;
bonding the semiconductor die to the non-photosensitive protection layer;
encapsulating a second surface opposite to the first surface of the semiconductor die; and
forming a redistribution layer on the contact pad and the non-photosensitive protection layer opposite to the first surface.
2 - 20 . (canceled)