Patent Assignment
Reel/Frame 061371/0169
Assignment of Assignor's Interest
Recorded: 2022-09-01
Pages: 6
Assignors
LEE, SHAO-CHIEN
Executed: 2022-08-18
CHEN, CHING-SHENG
Executed: 2022-08-18
NIEN, HENG-MING
Executed: 2022-08-18
WANG, PEI-WEI
Executed: 2022-08-18
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 179, SHANYING RD., GUISHAN DIST., TAOYUAN CITY, 333422, TAIWAN
Covered Property
(1)
Plurality of Build-Up Layers in a Circuit Board Structure