Patent Assignment
Reel/Frame 061436/0100
Assignment of Assignor's Interest
Recorded: 2022-10-17
Pages: 2
Assignor
LI, WEIPING
Executed: 2021-12-26
Assignee
YIBU SEMICONDUCTOR CO., LTD.
5045 WAI QING SONG RD., QINGPU DISTRICT, #20, AREA A, RM. 510, SHANGHAI, 201700, CHINA
Covered Property
(1)
Method for Forming Semiconductor Package and Semiconductor Package