Patent Assignment
Reel/Frame 061443/0338
Assignment of Assignor's Interest
Recorded: 2022-10-17
Pages: 7
Assignors
JIN, YU-FENG
Executed: 2019-02-11
MA, SHENG-LIN
Executed: 2019-02-11
ZHAO, QIAN-CHENG
Executed: 2019-02-11
CHIU, YI-HSIANG
Executed: 2019-02-11
LIU, HUAN
Executed: 2019-02-11
LEE, HUNG-PING
Executed: 2019-02-11
GONG, DAN
Executed: 2019-02-11
Assignees
J-METRICS TECHNOLOGY CO., LTD.
9F, NO. 102, SEC. 3, MINQUAN E. RD.,, SONGSHAN DIST.,, TAIPEI CITY, 105, TAIWAN
PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL
SCHOOL OF ELECTRONIC AND COMPUTER ENGINEERING,, PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, PEKING UNIVERSITY, SHENZHEN, 518055, CHINA
Covered Property
(1)
Wafer Level Ultrasonic Chip Module Having Suspension Structure
Application:
17/945,697 →
Publication:
US 2023/0014827
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 26, 2023
From: J-METRICS TECHNOLOGY CO., LTD.
To: SONICMEMS (ZHENGZHOU) TECHNOLOGY CO.,LTD
Reel/Frame 063445/0963 →
Assignment of Assignor's Interest
May 10, 2023
From: J-METRICS TECHNOLOGY CO., LTD.
To: SONICMEMS (ZHENGZHOU) TECHNOLOGY CO.,LTD.
Reel/Frame 063600/0340 →