Patent Assignment
Reel/Frame 061452/0057
Assignment of Assignor's Interest
Recorded: 2022-09-16
Pages: 26
Assignors
MINAMI, KAICHIRO
Executed: 2022-08-28
AKAE, NAONORI
Executed: 2022-08-31
HIRANO, AKITO
Executed: 2022-09-05
SUYAMA, SADAYASU
Executed: 2022-09-01
YAMAMOTO, TAKAYUKI
Executed: 2022-09-05
ASAKURA, SHUNSUKE
Executed: 2022-09-05
ORIHASHI, YUGO
Executed: 2022-08-29
MEGAWA, YASUHIRO
Executed: 2022-08-30
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Method of Processing Substrate, Method of Manufacturing Semiconductor Device, Recording Medium, and Substrate Processing Apparatus
Application:
17/945,550 →
Publication:
US 2023/0295837