Patent Assignment
Reel/Frame 061464/0172
Assignment of Assignor's Interest
Recorded: 2022-10-19
Pages: 2
Assignors
GUO, FRANK.ZY
Executed: 2022-10-17
LIAO, YI-TIEN
Executed: 2022-10-19
LAI, SAM
Executed: 2022-10-17
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Property
(1)
Semiconductor Device with Thermal Dissipation and Method Therefor