Patent Assignment
Reel/Frame 061477/0507
Assignment of Assignor's Interest
Recorded: 2022-10-20
Pages: 3
Assignor
LIN, SI WEN
Executed: 2018-06-29
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Coupling Mechanisms for Substrates, Semiconductor Packages, and/or Printed Circuit Boards