Assignment of Assignor's Interest

Recorded: 2022-10-05 Pages: 3

Assignors

SENDA, TAKESHI

Executed: 2022-06-07

SUDO, HARUO

Executed: 2022-06-08

Assignee

GLOBALWAFERS JAPAN CO., LTD.

6-861-5, HIGASHIKO, SEIRO-MACHI, KITAKANBARA-GUN, NIIGATA, 9570197, JAPAN

Covered Property (1)

Method for Manufacturing Semiconductor Silicon Wafer Composed of Silicon Wafer Substrate and Silicon Monocrystalline Epitaxial Layer

Application: 17/760,224 →

Publication: US 2023/0073641