IP Library › Assignment 061488/0918
Patent Assignment
Reel/Frame 061488/0918

Assignment of Assignor's Interest

Recorded: 2022-09-20 Pages: 4
Assignors
JEONG, WONTAE
Executed: 2019-06-25
PARK, EUNGKYU
Executed: 2019-06-24
LEE, DONGYEOP
Executed: 2019-06-25
KIM, YONGHWA
Executed: 2019-06-25
LEE, GIHOON
Executed: 2019-06-25
LEE, JAEHWAN
Executed: 2019-06-25
CHOI, SEUNGBUM
Executed: 2019-06-25
CHOI, HYOUNGGIL
Executed: 2019-07-01
HEO, CHANGRYONG
Executed: 2019-06-25
Assignee
SAMSUNG ELECTRONICS CO., LTD
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Electronic Device with Sealing Structure
Application: 17/933,787 →
Publication: US 2023/0020693