Patent Assignment
Reel/Frame 061495/0181
Assignment of Assignor's Interest
Recorded: 2022-10-21
Pages: 7
Assignors
ZAIDY, ALIASGER T.
Executed: 2022-08-10
PAREKH, KUNAL R
Executed: 2022-09-07
EILERT, SEAN S.
Executed: 2022-09-10
HUSH, GLEN E.
Executed: 2022-09-07
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Properties
(2)
Wafer-On-Wafer Formed Memory and Logic
Application:
63/231,660 →
Signal Routing Between Memory Die and Logic Die for Mode Based Operations
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 21, 2022
From: PAREKH, KUNAL R; EILERT, SEAN S.; ZAIDY, ALIASGER T; HUSH, GLEN E.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 061494/0923 →
Assignment of Assignor's Interest
Oct 21, 2022
From: EILERT, SEAN S.; ZAIDY, ALIASGER T.; PAREKH, KUNAL R.; HUSH, GLEN E.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 061494/0319 →
Assignment of Assignor's Interest
Oct 21, 2022
From: PAREKH, KUNAL R; EILERT, SEAN S.; ZAIDY, ALIASGER T.; HUSH, GLEN E.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 061495/0544 →