Patent Assignment
Reel/Frame 061513/0768
Assignment of Assignor's Interest
Recorded: 2022-10-24
Pages: 8
Assignors
TANUMA, HIROMITSU
Executed: 2022-09-26
NAKAYAMA, SHINICHI
Executed: 2022-09-26
MUMOD ALI, NOR RAZALI ROHMAN
Executed: 2022-09-26
LIM, KOK SHENG
Executed: 2022-09-26
Assignee
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU,, TOKYO, 105-8518, JAPAN
Covered Property
(1)
Electrode Filament Connection Member, Chemical Vapor Deposition Apparatus, and Method for Manufacturing Recording Medium Substrate
Application:
18/048,982 →
Publication:
US 2023/0133485
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Declaration of Succession
Mar 8, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 063011/0157 →
Change of Address
Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
Assignment of Assignor's Interest
Oct 15, 2024
From: RESONAC CORPORATION
To: RESONAC HARD DISK CORPORATION
Reel/Frame 069167/0673 →