Patent Assignment
Reel/Frame 061548/0473
Assignment of Assignor's Interest
Recorded: 2022-10-26
Pages: 3
Assignors
FU, SHIH-KANG
Executed: 2020-05-18
LEE, MING-HAN
Executed: 2020-05-18
SHUE, SHAU-LIN
Executed: 2020-05-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6,, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Hybrid Method for Forming Semiconductor Interconnect Structure