IP Library › Assignment 061574/0140
Patent Assignment
Reel/Frame 061574/0140

Assignment of Assignor's Interest

Recorded: 2022-10-28 Pages: 7
Assignors
YAMAZAKI, RYOSUKE
Executed: 2022-10-26
YAMAMOTO, SHINICHI
Executed: 2022-10-18
OZAKI, KOUICHI
Executed: 2022-10-26
IMAIZUMI, TORU
Executed: 2022-10-13
Assignee
DOW TORAY CO., LTD.
2-24, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU, TOKYO, 140-8617, JAPAN
Covered Property (1)
Curable Hot-Melt Silicone Composition, Cured Product Thereof, and Laminate Including Curable Hot-Melt Silicone Composition or Cured Product Thereof
Application: 17/912,847 →
Publication: US 2023/0151215