Patent Assignment
Reel/Frame 061588/0389
Assignment of Assignor's Interest
Recorded: 2022-10-31
Pages: 4
Assignors
DIA, KIN-HOOI
Executed: 2022-09-15
HSIEH, HO-CHIEH
Executed: 2022-09-22
TSAI, HSING-I
Executed: 2022-09-15
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Structure of Hybrid Cell Array
Application:
18/051,026 →
Publication:
US 2023/0178537