Assignment of Assignor's Interest

Recorded: 2022-10-31 Pages: 3

Assignors

DENG, LIQUN

Executed: 2022-10-08

YANG, HANQI

Executed: 2022-10-06

CHEN, PINHONG

Executed: 2022-10-05

Assignee

CADENCE DESIGN SYSTEMS, INC.

2655 SEELY AVENUE, SAN JOSE, CALIFORNIA, 95134

Covered Property (1)

Method of Die Interface Modeling for Concurrent Multi-Die Implementation of Three-Dimensional Integrated Circuit (3D-IC)

Application: 17/977,866 →