Patent Assignment
Reel/Frame 061624/0862
Assignment of Assignor's Interest
Recorded: 2022-11-02
Pages: 5
Assignors
HAN, JI HYE
Executed: 2022-10-14
KIM, JUNG MIN
Executed: 2022-10-14
CHOI, HONG JE
Executed: 2022-10-14
KANG, BYUNG WOO
Executed: 2022-10-14
PARK, HYE JIN
Executed: 2022-10-14
LEE, SANG WOOK
Executed: 2022-10-14
KOO, BON SEOK
Executed: 2022-10-14
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component