Patent Assignment
Reel/Frame 061644/0456
Assignment of Assignor's Interest
Recorded: 2022-11-03
Pages: 7
Assignors
LEE, HYEONJU
Executed: 2022-06-22
KIM, JIYOUNG
Executed: 2022-06-22
PARK, JAEHYUN
Executed: 2022-07-04
SON, SEUK
Executed: 2022-07-11
LEE, SOOEUN
Executed: 2022-07-04
CHOI, DONGCHUL
Executed: 2022-06-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device