Patent Assignment
Reel/Frame 061655/0523
Assignment of Assignor's Interest
Recorded: 2022-11-04
Pages: 3
Assignors
LEE, JUNGKEUN
Executed: 2022-11-01
CHOI, CHUNSIK
Executed: 2022-11-01
JEUNG, YONGHEE
Executed: 2022-11-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wearable Electronic Device Having Heat Dissipation Structure