Patent Assignment
Reel/Frame 061657/0773
Assignment of Assignor's Interest
Recorded: 2022-11-04
Pages: 2
Assignor
OWAKI, HIROFUMI
Executed: 2022-06-28
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Sensor Module and Method for Producing Sensor Module by Laser Welding