Patent Assignment
Reel/Frame 061673/0745
Assignment of Assignor's Interest
Recorded: 2022-11-07
Pages: 4
Assignees
RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN
RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN, GAOXIN SOUTH 7TH BLVD. NANSHAN DISTRICT SHENZHEN, GUANGDONG, 518057, CHINA
TSINGHUA UNIVERSITY
QINGHUA YUAN HAIDIAN DISTRICT, BEIJING, 100084, CHINA
Covered Property
(1)
Atomic-Smooth Device with Microstructure, and Method for Preparing Same
Application:
17/923,648 →
Publication:
US 2023/0271825